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GD9FS1G8F2ALG датащи(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

номер детали GD9FS1G8F2ALG
подробное описание детали  Single level cell technology
PDF  55 Pages
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производитель  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
домашняя страница  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD9FS1G8F2ALG датащи(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

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GD9Fx1GxF2A
48
Dimensions
Symbol
A
A1
A2
b
D
Hd
E
E1
e
L
L1
θ
Unit
mm
Min
-
0.05
0.90
0.14
18.30
19.80
11.90
-
0.50
0.425
0.60
0
Nom
-
0.10
1.00
0.22
18.40
20.00
12.00
-
0.525
0.80
-
Max
1.20
0.15
1.10
0.30
18.50
20.20
12.10
12.40
0.625
1.00
7
Note：
1.
Tolerance of the dimension should be ±0.1 unless otherwise specified.
2.
Corner radius should be less than ±0.1R unless otherwise specified (excluding outer lead).
3.
Tolerance of the angles should be ±0.5 degree unless otherwise specified.
4.
The mold surface should have a finish 8±2S without luster.
Trace of knockout pin and the ahaded portion of detail “A” should be polish surface.
5.
Discrepancies between upper and lower molding cavity should be less than 0.05 of the package.
6.
Mold flash should be less than 0.2mm.



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