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HTADC12 датащи(PDF) 11 Page - Honeywell Solid State Electronics Center

номер детали HTADC12
подробное описание детали  High Temperature 12-Bit A/D Converter
PDF  12 Pages
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производитель  HONEYWELL [Honeywell Solid State Electronics Center]
домашняя страница  http://honeywell.com/Pages/Home.aspx
Logo HONEYWELL - Honeywell Solid State Electronics Center

HTADC12 датащи(HTML) 11 Page - Honeywell Solid State Electronics Center

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Switching Time
Delay time to achieve settled data when switching between
the two data bytes will be dependent on the amount of load
capacitance present on the output drivers. A general guideline
for estimating the delay is given by the formula
TD = 4.0 ns + 0.25 ns/pF × CL
where TD is the delay time in ns, and CL is the capacitive
load on each output driver in pF.
TD represents the total time required for an output driver’s
voltage level to fall to 10% of its previous logic high value,
or to rise to 90% of its logic high value from a logic low,
after A0 is asserted.
Grounding and Decoupling
Analog and Digital Grounding
Proper grounding is essential in any high speed, high-resolution
system. Multilayer printed circuit boards (PCBs) are
recommended to provide optimal grounding and power
schemes. The use of ground and power planes offers distinct
advantages:
1. The minimization of the loop area encompassed by
a signal and its return path.
2. The minimization of the impedance associated with
ground and power paths.
3. The inherent distributed capacitor formed by the power
plane, PCB insulation and ground plane.
These characteristics result in both a reduction of
electromagnetic interference (EMI) and an overall improvement
in performance.
Cload (pF)
Approximate TD (ns)
10
6.5
50
32.5
100
65.0
It is important to design a layout that prevents noise from
coupling onto the input signal. Digital signals should not be run
in parallel with input signal traces and should be routed away
from the input circuitry. While the HTADC12 features separate
analog and digital power and ground pins, it should be treated
as an analog component. The VSSA and VSS pins must be
joined together directly under the HTADC12. A solid ground
plane under the A/D is acceptable if the power and ground
return currents are carefully managed. Alternatively, the ground
plane under the A/D may contain serrations to steer currents
in predictable directions where cross coupling between analog
and digital would otherwise be unavoidable.
Analog and Digital Driver Supply Decoupling
The HTADC12 features separate analog and digital supply and
ground pins, helping to minimize digital corruption of sensitive
analog signals.
In general, VDDA, the analog supply, should be decoupled
to VSSA, the analog common, as close to the chip as
physically possible.
Reliability
Honeywell understands the stringent reliability requirements that
high temperature systems require and has extensive experience
in reliability testing on programs of this nature. Reliability
attributes of the SOI process were characterized by testing
specially designed structures to evaluate failure mechanisms
including hot carriers, electro-migration, and time-dependent
dielectric breakdown. The results are fed back to improve
the process to ensure the highest reliability products.
11
Switching Time



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