ADF4153ABCPZ datasheet(22/24 Pages) AD

22 / 24 page

ADF4153A

Data Sheet

Rev. A | Page 22 of 24

OUTLINE DIMENSIONS

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 26. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeter

0.50

BSC

0.65

0.60

0.55

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-1.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.30

2.10 SQ

2.00

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 27. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-6)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF4153ABCPZ

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-20-6

ADF4153ABCPZ-RL7

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-20-6

ADF4153ABRUZ

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADF4153ABRUZ-RL7

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP

RU-16

EV-ADF4153ASD1Z

Evaluation board for ADF4153A in LFCSP package

Z = RoHS Compliant Part.

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