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LPC83X датащи(PDF) 65 Page - NXP Semiconductors |
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LPC83X датащи(HTML) 65 Page - NXP Semiconductors |
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65 / 78 page ![]() LPC83x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.2 — 4 April 2018 65 of 78 NXP Semiconductors LPC83x 32-bit ARM Cortex-M0+ microcontroller 14.2 XTAL Printed-Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1,Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in Fig 40. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 24. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 300 39 pF, 39 pF 30 pF < 300 57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 200 39 pF, 39 pF 30 pF < 100 57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 60 39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF Table 25. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF |
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