FN7393 Rev 2.00

Page 9 of 10

September 21, 2010

EL5525

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its

subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

For additional products, see www.intersil.com/en/products.html

© Copyright Intersil Americas LLC 2004-2010. All Rights Reserved.

All trademarks and registered trademarks are the property of their respective owners.

package power dissipation curves provide a convenient way

to see if the device will overheat.

THERMAL SHUTDOWN

The EL5525 has an internal thermal shutdown circuitry that

prevents overheating of the part. When the junction

temperature goes up to about +150°C, the part will be

disabled. When the junction temperature drops down to

about +120°C, the part will be enabled. With this feature, any

short circuit at the outputs will enable the thermal shutdown

circuitry to disable the part.

POWER SUPPLY BYPASSING AND PRINTED CIRCUIT

BOARD LAYOUT

Good printed circuit board layout is necessary for optimum

performance. A low impedance and clean analog ground

plane should be used for the EL5525. The traces from the

two ground pins to the ground plane must be very short. The

thermal pad of the EL5525 should be connected to the

analog ground plane. Lead length should be as short as

possible and all power supply pins must be well bypassed. A

Application Drawing

REFH

VS

VSD

SDI

ENA

OSC

CAP

REFL

OUTA

OUTB

OUTC

OUTD

OUTE

OUTF

OUTQ

OUTR

MICROCONTROLLER

COLUMN

(SOURCE)

DRIVER

0.1µF

0.1µF

0.1µF

0.1µF

HIGH REFERENCE

VOLTAGE

+10V

+12V

+5V

EL5525

LCD PANEL

GND

HORIZONTAL RATE

LCD

TIMING

CONTROLLER

SCK

SDO

0.1µF

OSC_SET

+1V

5V