MP6528 datasheet(3/17 Pages) MPS

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MP6528 – 5V TO 60V, H-BRIDGE GATE DRIVER

MP6528 Rev. 1.03

www.MonolithicPower.com

6/20/2017

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS

(1)

Input voltage (VIN) .......................... -0.3V to 65V

CPA ............................................... -0.3V to 60V

CPB ............................................ -0.3V to 12.5V

VREG ............................................ -0.3V to 13V

BSTA/B/C ...................................... -0.3V to 70V

GHA/B/C........................................ -0.3V to 70V

GHA/B/C (Transient, 2

μS) ................ -8V to 70V

SHA/B/C ........................................ -0.3V to 65V

SHA/B/C (Transient, 2

μS)................. -8V to 65V

GLA/B/C ........................................ -0.3V to 13V

LSS.................................................. -0.3V to 1V

All other pins to AGND.................. -0.3V to 6.5V

Continuous power dissipation (TA = +25°C)

(2)

QFN-28 (4mmx4mm)

……………………2.9W

Storage temperature................ -55

C to +150C

Junction temperature ............................. +150

C

Lead temperature (solder) ..................... +260

C

Recommended Operating Conditions

(3)

Input voltage (VIN) ............................ +5V to 60V

OCREF voltage (VOC) ................ 0.125V to 2.4V

Operating junct. temp (TJ) ........ -40C to +125C

Thermal Resistance

(4)

θJA

θJC

QFN-28 (4mmx4mm) ............. 42 ....... 9.... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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