4

INA231

SBOS644B – FEBRUARY 2013 – REVISED AUGUST 2017

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Copyright © 2013–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

+30 V.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

6

V

Analog inputs, IN+, IN–

(2)

–30

30

V

Common-mode

–0.3

30

V

SDA

GND – 0.3

6

V

SCL

GND – 0.3

6

V

Input current into any pin

5

mA

Open-drain digital output current

10

mA

–40

125

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

2500

V

1000

Machine model (MM)

150

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Common-mode voltage

0

28

V

Operating supply voltage

2.7

5.5

V

Operating ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

INA231

UNIT

YFD (DSBGA)

YFF (DSBGA)

12 PINS

12 PINS

Junction-to-ambient thermal resistance

83.8

90.2

°C/W

Junction-to-case (top) thermal resistance

0.4

0.5

°C/W

Junction-to-board thermal resistance

19.3

40.0

°C/W

Junction-to-top characterization parameter

0.3

3.0

°C/W

Junction-to-board characterization parameter

19.4

39.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W