www.ti.com

EXAMPLE BOARD LAYOUT

12X (

)

0.23

(0.4) TYP

(0.4) TYP

(

)

METAL

0.23

0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(

)

SOLDER MASK

OPENING

0.23

0.05 MIN

DSBGA - 0.625 mm max height

YFF0012

DIE SIZE BALL GRID ARRAY

4222191/A 07/2015

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,

see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:30X

C

1

2

3

A

B

D

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

DEFINED