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SSD1801Z датащи(PDF) 5 Page - List of Unclassifed Manufacturers |
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SSD1801Z датащи(HTML) 5 Page - List of Unclassifed Manufacturers |
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5 / 42 page ![]() SOLOMON Rev 1 .1 01/2003 SSD1801 Series 4 PIN ARRANGEMENT OF SSD1801Z GOLD BUMP DIE Alignment Keys Figure 2 – SSD1801Z Pin Arrangement Die Size: 6170um x 1480um (include scribe line) 6070um x 1380um (exclude scribe line) Die Thickness: 670 +/-25um Bump Size Minimum Pitch PAD: 1-63 52.15 x 60.2 um 76.3um PAD: 65-79, 164-178 74.9 x 42 um 63.7um PAD: 81-162 42 x 74.9 um 63.7um PAD: 64,80,163,179 52.15 X 52.15 um Bump Height: Nominal 18um Note: 1. The die faces up in the diagram. 2. Coordinates are reference to the center of the chip. 3. Unit of coordinates and size of all alignment keys are in um. 4. All alignment keys do not contain gold bump. (-2835, -598.5) X 37.6 µm 8.75 µm (2835, -598.5) X 37.6 µm 8.75 µm X Center (-2940.9, 480.0) 26.3 µm 26.3 µm 26.3 µm X Center (2940.9, 480.0) 26.3 µm 26.3 µm 26.3 µm 61.3 µm Center (-2101.9, 169.6) X |
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