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HT69F360 датащи(PDF) 61 Page - Holtek Semiconductor Inc |
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HT69F360 датащи(HTML) 61 Page - Holtek Semiconductor Inc |
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61 / 235 page ![]() Rev. 1.30 �0 �ove��e� 1�� �01� Rev. 1.30 �1 �ove��e� 1�� �01� HT69F340/HT69F350/HT69F360 TinyPowerTM I/O Flash MCU with LCD & EEPROM HT69F340/HT69F350/HT69F360 TinyPowerTM I/O Flash MCU with LCD & EEPROM External Crystal/Ceramic Oscillator – HXT TheExternalCrystal/CeramicSystemOscillatorisoneofthehighfrequencyoscillatorchoices, whichisselectedbytheFHSbitandenabledbyHXTENbit.Formostcrystaloscillator configurations,thesimpleconnectionofacrystalacrossOSC1andOSC2willcreatethenecessary phaseshiftandfeedbackforoscillation,withoutrequiringexternalcapacitors.However,forsome crystaltypesandfrequencies,toensureoscillation,itmaybenecessarytoaddtwosmallvalue capacitors,C1andC2.Usingaceramicresonatorwillusuallyrequiretwosmallvaluecapacitors, C1andC2,tobeconnectedasshownforoscillationtooccur.ThevaluesofC1andC2shouldbe selectedinconsultationwiththecrystalorresonatormanufacturer’sspecification. Foroscillatorstabilityandtominimisetheeffectsofnoiseandcrosstalk,itisimportanttoensure thatthecrystalandanyassociatedresistorsandcapacitorsalongwithinterconnectinglinesareall locatedasclosetotheMCUaspossible. OS C1 OS C2 Rf To i nt er nal ci rc ui ts In te rn al O sci lla to r Ci rc ui t C1 C2 Rp No te :1 . Rp i s nor ma lly not r equi r ed. C 1 and C2 a re r equ ir ed. 2. A lt hough not s how n OS C1 /O SC 2 pi ns h av e a pa ra si ti c c apac it an ce o f a r ound 7pF . Crystal/Resonator Oscillator – HXT Crystal Oscillator C1 and C2 Values Crystal Frequency C1 C2 1�MHz 0pF 0pF 1�MHz 0pF 0pF � MHz 0pF 0pF 4 MHz 0pF 0pF 1 MHz 100pF 100pF �ote: C1 and C� values a�e fo� guidance only. Crystal Recommended Capacitor Values Internal RC Oscillator – HIRC TheinternalRCoscillatorisafullyintegratedsystemoscillatorrequiringnoexternalcomponents. TheinternalRCoscillatorisoneofthehighfrequencyoscillatorchoices,whichisselectedby theFHSbitandisenabledbyHIRCENbit.TheHIRCoscillatorhasthreefrequenciesof4MHz, 8MHzor12MHz,selectedbyHIRC1~HIRC0bitsinSCCregister.Devicetrimmingduringthe manufacturingprocessandtheinclusionofinternalfrequencycompensationcircuitsareusedto ensurethattheinfluenceofthepowersupplyvoltage,temperatureandprocessvariationsonthe oscillationfrequencyareminimised.Asaresult,atapowersupplyof5Vandattemperatureof25°C degrees,thefixedoscillationfrequencyoftheHIRCwillhaveatolerancewithin2%.Notethatif thisinternalsystemclockoptionisselected,asitrequiresnoexternalpinsforitsoperation. |
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