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SMX1J датащи(PDF) 5 Page - STMicroelectronics |
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SMX1J датащи(HTML) 5 Page - STMicroelectronics |
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5 / 11 page ![]() SMX1J Package information Doc ID 16180 Rev 3 5/11 3 Package information ● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 ● Flammability: Epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose Table 3. µQFN-2L dimensions Ref Dimensions Millimetres Inches Min Typ Max Min Typ Max A 0.51 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b1 0.25 0.30 0.35 0.010 0.012 0.014 D1.45 0.057 E1.00 0.039 e 0.95 1.00 1.05 0.037 0.039 0.041 L1 0.75 0.80 0.85 0.030 0.031 0.033 Figure 11. Footprint dimensions in mm (inches) Figure 12. Marking D E A1 A b1 e L1 Pin 1 ID 0.83 (0.022) (0.067) 1.72 (0.033) 0.55 (0.022) 0.55 (0.024) 0.62 L Pin 1 Pin 2 |
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