DocID025317 Rev 2

15/17

STA333SML

Package mechanical data

17

4.1

Soldering information

Figure 11. Recommended soldering reflow profile for mounting on PCB

Table 9. Recommended soldering reflow values for mounting on PCB

Profile

Typ.

Max.

Temp. gradient in preheat (T = 70 - 180 °C)

0.9 °C/s

3 °C/s

Temp.gradient (T = 200 - 225 °C)

2 °C/s

3 °C/s

Peak temp. in reflow

240 - 245 °C

260 °C

Time above 220 °C

60 s

90 s

Temp. gradient in cooling

-2 to -3 °C

-6 °C

Time from 50 to 220 °C

160 to 220 s