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LQFP100 датащи(PDF) 44 Page - STMicroelectronics

номер детали LQFP100
подробное описание детали  Up to 60 DMIPs operation
PDF  116 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

LQFP100 датащи(HTML) 44 Page - STMicroelectronics

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Package pinouts and signal descriptions
SPC560B40x/50x, SPC560C40x/50x
44/116
DocID14619 Rev 13
Note:
RAM data retention is guaranteed with VDD_LV not below 1.08 V.
3.14
Thermal characteristics
3.14.1
Package thermal characteristics
IINJPAD
SR
Injected input current on any pin during
overload condition
55
mA
IINJSUM
SR
Absolute sum of all injected input currents
during overload condition
50
50
TVDD
SR VDD slope to ensure correct power up
(6)
—3.0(7)
250 x 103
(0.25
[V/µs])
V/s
1.
100 nF capacitance needs to be provided between each VDD/VSS pair.
2.
Full device operation is guaranteed by design when the voltage drops below 4.5 V down to 3.0 V. However, certain analog
electrical characteristics will not be guaranteed to stay within the stated limits.
3.
330 nF capacitance needs to be provided between each VDD_LV/VSS_LV supply pair.
4.
100 nF capacitance needs to be provided between VDD_BV and the nearest VSS_LV (higher value may be needed
depending on external regulator characteristics).
5.
1 µF (electrolithic/tantalum) + 47 nF (ceramic) capacitance needs to be provided between VDD_ADC/VSS_ADC pair. Another
ceramic cap of 10 nF with low inductance package can be added.
6.
Guaranteed by device validation.
7.
Minimum value of TVDD must be guaranteed until VDD reaches 2.6 V (maximum value of VPORH).
Table 14. Recommended operating conditions (5.0 V) (continued)
Symbol
Parameter
Conditions
Value
Unit
Min
Max
Table 15. LQFP thermal characteristics(1)
Symbol
C
Parameter
Conditions(2)
Pin count
Value
Unit
RJA
CC
D
Thermal resistance, junction-to-
ambient natural convection(3)
Single-layer board - 1s
64
60
°C/W
100
64
144
64
Four-layer board - 2s2p
64
42
100
51
144
49
RJB
CC
D
Thermal resistance, junction-to-
board(4)
Single-layer board - 1s
64
24
°C/W
100
36
144
37
Four-layer board - 2s2p
64
24
100
34
144
35



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