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LQFP100 датащи(PDF) 105 Page - STMicroelectronics

номер детали LQFP100
подробное описание детали  Up to 60 DMIPs operation
PDF  116 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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LQFP100 датащи(HTML) 105 Page - STMicroelectronics

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DocID14619 Rev 13
105/116
SPC560B40x/50x, SPC560C40x/50x
Package characteristics
115
D
16.80
17.00
17.20
0.6614
0.6693
0.6772
D1
15.00
0.5906
E
16.80
17.00
17.20
0.6614
0.6693
0.6772
E1
15.00
0.5906
e
1.00
0.0394
F
1.00
0.0394
ddd
0.20
0.0079
eee
0.25
0.0098
(4)
fff
0.10
0.0039
(5)
1.
Values in inches are converted from mm and rounded to four decimal digits.
2.
LBGA stands for Low profile Ball Grid Array.
— Low profile: The total profile height (Dim A) is measured from the seating plane to the top of the
component
— The maximum total package height is calculated by the following methodology:
A2 Typ + A1 Typ +
 (A12 + A32 + A42 tolerance values)
— Low profile: 1.20 mm
 A 1.70 mm
3.
The typical ball diameter before mounting is 0.60 mm.
4.
The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5.
The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
Each tolerance zone fff in the array is contained entirely in the respective zone eee above.
The axis of each ball must lie simultaneously in both tolerance zones.
Table 53. LBGA208 mechanical data (continued)
Symbol
mm
inches(1)
Notes
Min
Typ
Max
Min
Typ
Max



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