LM2759SDEV datasheet(3/22 Pages) TI1

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LM2759

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SNVS577D – JUNE 2008 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN pin: Voltage to GND

-0.3V to 6.0V

Strobe, TX, SDA, SCL, ISINK pins: Voltage to GND

-0.3V to (VIN + 0.3V)

w/ 6.0V max

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-65°C to 150°C

Maximum Lead Temp. (Soldering)

(5)

ESD Rating

Human Body Model(6)

2.5KV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential to the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and

disengages at TJ = 120°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1187 (SNOA401).

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

LED Voltage Range

2.0V to 4.0V

Junction Temperature Range (TJ)

-30°C to +125°C

Ambient Temperature Range (TA)

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential to the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP =

125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP - (θJA × PD-MAX).

Thermal Information

Junction-to-Ambient Thermal Resistance, (

θJA),

(1)

36.7°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The test board is a 4–layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array

of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 53µm/35µm/35µm/53µm

(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.The value of

θJA of this product in the

WSON package could fall in a range as wide as 30ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and

environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid

to thermal dissipation issues. For more information on these topics, please refer to Application Note AN-1187 (SNOA401): and the

Power Efficiency and Power Dissipation section of this datasheet.

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