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LM9830 датащи(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали LM9830
подробное описание детали  LM9830 36-Bit Color Document Scanner
PDF  45 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM9830 датащи(HTML) 6 Page - National Semiconductor (TI)

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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional,
but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND=AGND=DGND=DGNDI/O=DGNDSRAM=0V, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN<GND or VIN>VA or VD), the current at that pin should be limited to 25mA. The 50mA max-
imum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25mA to two.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, ΘJA and the ambient temperature, TA. The maximum allow-
able power dissipation at any temperature is PD = (TJmax - TA) / ΘJA. TJmax = 150°C for this device. The typical thermal resistance (ΘJA) of this part when board mounted
is 53°C/W
.
Note 5: Human body model, 100pF capacitor discharged through a 1.5k
Ω resistor.
Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor Linear
Data Book for other methods of soldering surface mount devices.
Note 7: Two diodes clamp the OS analog inputs to
AGND and VA as shown below. This input protection, in combination with the external clamp capacitor and the output
impedance of the sensor, prevents damage to the LM9830 from transients during power-up.
Note 8: For best performance, it is required that all supply pins be powered from the same power supply with separate bypass capacitors at each supply pin.
Note 9: Typicals are at TJ=TA=25°C, fCRYSTAL IN = 50MHz, and represent most likely parametric norm.
Note 10: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 11: Integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that best fits the actual transfer function of the ADC.
Note 12: VREF is defined as the CCD OS voltage for the reference period following the reset feedthrough pulse. VWHITE is defined as the peak CCD pixel output voltage for
a white (full scale) image with respect to the reference level, VREF . VRFT is defined as the peak positive deviation above VREF of the reset feedthrough pulse. The maximum
correctable range of pixel-to-pixel VWHITE variation is defined as the maximum variation in VWHITE (due to PRNU, light source intensity variation, optics, etc.) that the
SRAM Write Timing (Figure 8) - Typical Values Represent Worst Case Timing for Different MCLK Frequencies
tWR F ADDR
SETUP
Address valid to WR falling
0.5 tMCLK
- 7ns
3
ns (min)
tWR R ADDR
SETUP
Address valid to WR rising
1.5 tMCLK
- 9ns
21
ns (min)
tWR DATA SETUP DB0-DB7 valid to WR rising
1 tMCLK
- 9ns
11
ns (min)
tWR
WR pulse width
1 tMCLK
- 5ns
15
ns (min)
tWR ADDR HOLD WR rising to Address data change
0.33 tMCLK
- 4ns
2
ns (min)
tWR DATA HOLD
WR rising to DB0-DB7 data Tri-State
1
4
ns (max)
SRAM Read Timing (Figure 9) - Typical Values Represent Worst Case Timing for Different MCLK Frequencies
tRD SETUP
Address valid to DB0-DB7 data valid
4 slot mode
2 tMCLK - 12ns
28
ns (max)
8 slot mode
(fMCLK = 25MHz)
1 tMCLK - 12ns
AC Electrical Characteristics
The following specifications apply for AGND=DGND=DGNDI/O=DGNDSRAM=0V, VA=VD=VDI/O=VSRAM=+5.0VDC,
fCRYSTAL IN= 50MHz, MCLK DIVIDER = 1.0 (unless otherwise noted), fMCLK = fCRYSTAL IN/MCLK DIVIDER, fADC CLK = fMCLK/8,
CL (databus loading) = 20pF/pin. Boldface limits apply for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7 & 8)
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 10)
Units
(Limits)
OS Input
AGND
VA
To Internal
Circuitry



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