SST25VF080B

DS20005045C-page 24

 2015 Microchip Technology Inc.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14003A Sheet 1 of 1

8-Lead Small Outline Integrated Circuit (SAE/F) - 5x6 mm Body [SOIC]

Note:

1. Complies with JEDEC publication 95 MS-012 AA dimensions,

although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (max/min).

3. Coplanarity: 0.1 mm

4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.