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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MIC2875 датащи(PDF) 16 Page - Microchip Technology |
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MIC2875 датащи(HTML) 16 Page - Microchip Technology |
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16 / 24 page  MIC2875 DS20005549A-page 16 2015 Microchip Technology Inc. FIGURE 7-3: Determining PCB Area for a Given PCB Thermal Resistance. Figure 7-3 shows the total area of a round or square pad, centered on the device. The solid trace represents the area of a square, single-sided, horizontal, solder masked, copper PC board trace heat sink, measured in square millimeters. No airflow is assumed. The dashed line shows the PC board’s trace heat sink covered in black oil-based paint and with 1.3 m/sec (250 feet per minute) airflow. This approaches a “best case” pad heat sink. Conservative design dictates using the solid trace data, which indicates that a maximum pad size of 5000 mm2 is needed. This is a pad 71 mm × 71 mm (2.8 inches per side). |
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