MIC2875

DS20005549A-page 6

 2015 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Lead Temperature

—

—

260

—

°C

Soldering 10s

Storage Temperature Range

–65

—

+150

°C

—

Junction Operating Temperature

–40

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance, TDFN-22-8Ld

—

90

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.