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RN171 датащи(PDF) 7 Page - Microchip Technology |
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RN171 датащи(HTML) 7 Page - Microchip Technology |
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7 / 30 page ![]() 2014-2016 Microchip Technology Inc. DS70005171B-page 7 RN171 FIGURE 1-5: RN171 MODULE PHYSICAL DIMENSIONS (BOTTOM VIEW) FIGURE 1-6: RECOMMENDED HOST PCB FOOTPRINT FIGURE 1-7: SOLDER REFLOW TEMPERATURE PROFILE Note: Pads at: 0.190 x 0.890 0.260 x 0.025 0.575 x 1.035 are grounded plated through holes for shield mounting Bottom View Dimensions are in inches. Tolerances: PCB Outline: +/- 0.005” PCB Thickness: +/- 0.001” 0.060" 0.080" 0.040" 0.050 0.100 0.150 0.200 0.250 0.300 0.350 0.400 0.450 0.500 0.550 0.600 0.650 0.700 0.750 0.800 0.850 1 0.025 0.000 1.050 0.900 0.950 1.000 0.890 1.035 Note: 0.190 x 0.890 0.575 x 1.035 0.260 x 0.025 are grounded plated through holes for shield mounting . Pads at Recommend keeping host PCB top layer signal traces away (0.050" diameter). |
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