RN171

DS70005171B-page 6

 2014-2016 Microchip Technology Inc.

1.3

Mounting Details

Figure 1-4 and Figure 1-5 show the module’s physical

dimensions. Figure 1-6 shows the recommended host

PCB layout.

1.4

Soldering Recommendations

The RN171 wireless module was assembled using a

standard lead-free reflow profile as shown in

Figure 1-7. The module is compatible with standard

lead-free solder reflow profiles. To avoid damaging the

module, the following recommendations are given:

• Figure 1-8 gives a recommended reflow profile for

this module

• Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the last flow

FIGURE 1-4:

RN171 MODULE

PHYSICAL DIMENSIONS

(TOP AND SIDE VIEW)

35

SENSOR4

AI

36

SENSOR5

AI

37

SENSOR6

AI

38

SENSOR7

AI

39

GND

Power

Ground reference

40

RESET

DI

Module Reset. Internal 100 kΩ pull-up resistor. Apply a pulse of at

least 160

s

41

FORCE_AWAKE

DI

Module force awake. Internal 100 kΩ pull-down resistor. Apply pulse

for at least 245

s. While FORCE_AWAKE is asserted the module is

prevented from sleeping

42

GPIO14

DIO

43

RTS/GPIO13

44

CTS/GPIO12

DI/DIO

45

RX/GPIO11

DI/DIO

46

TX/GPIO10

47

GND

Power

Ground reference

48

SREG_3V3_CTRL

Power

Battery boost circuit control

49

VBATT

Power

Battery voltage

TABLE 1-1:

PIN DESCRIPTION

Note 1:

Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.

2:

Refer to Electrical Specifications for GPIO voltage and current limitations.

3:

Digital input/output (bidirectional) 8 mA drive, ~83 K internal pull-down. 3.3V tolerant. Reset State:

Pull-down.

4:

Digital input/output (bidirectional) 24 mA drive, no internal pull-down. 3.3V tolerant. Reset State: High-Z.

Do not allow to float.

5:

Analog input. 0-400 mV (Do not exceed 1.2V DC)

Top View

Side

View