5

TUSB1002

www.ti.com

SLLSEU4A – MAY 2016 – REVISED MAY 2016

Product Folder Links: TUSB1002

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the GND terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

4

V

IO Voltage Range

Differential Voltage between RX1P/N and

RX2P/N.

±2.5

V

Voltage at RX1P/N and RX2P/N.

–0.5

V

Voltage on Control IO pins

–0.5

V

105

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±6000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3.3 V Supply Voltage

3

3.3

3.6

V

Supply Ramp requirement

50

ms

100

mV

TUSB1002I Operating free-air temperature

–40

85

°C

TUSB1002 Operating free-air temperature

0

70

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TUSB1002, TUSB1002I

UNIT

RGE (VQFN)

RMQ (WQFN)

24 PINS

24 PINS

Junction-to-ambient thermal resistance

38.5

42.6

°C/W

Junction-to-case (top) thermal resistance

41.6

38.0

°C/W

Junction-to-board thermal resistance

16.3

15.4

°C/W

Junction-to-top characterization parameter

1.0

0.8

°C/W

Junction-to-board characterization parameter

16.4

15.4

°C/W

Junction-to-case (bottom) thermal resistance

6.9

5.3

°C/W