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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MCP9902 датащи(PDF) 41 Page - Microchip Technology |
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MCP9902 датащи(HTML) 41 Page - Microchip Technology |
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41 / 50 page  2015-2016 Microchip Technology Inc. DS20005382C-page 41 MCP9902/3/4 RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units CH Optional Center Pad Width Center Pad Chamfer Optional Center Pad Length Contact Pitch X2 Y2 1.30 0.90 MILLIMETERS 0.50 BSC MIN E MAX 0.28 Contact Pad Length (X8) Contact Pad Width (X8) Y1 X1 0.70 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2261A NOM 8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN] C Contact Pad Spacing 2.10 Contact Pad to Contact Pad (X6) G1 0.20 C E G X1 Y1 Y2 X2 2X CH (G2) SILK SCREEN 1 2 8 Contact Pad to Center Pad (X8) G1 0.25 REF REF: Reference Dimension, usually without tolerances, for reference only. Thermal Via Diameter V 0.30 ØV |
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