THS6092SLASH3 datasheet(24/46 Pages) TI1

24 / 46 page

THS6042, THS6043

350 mA, ±12 V ADSL CPE LINE DRIVERS

SLOS264G − MARCH 2000 − REVISED DECEMBER 2001

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

PCB design considerations (continued)

Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals.

With these preparatory steps in place, the THS6042/3 is simply placed in position and run through the solder

reflow operation as any standard surface-mount component. This results in a part that is properly installed.

The actual thermal performance achieved with the THS6042/3 in their PowerPAD packages depends on the

application. In the previous example, if the size of the internal ground plane is approximately 3 inches

× 3 inches,

then the expected thermal coefficient,

θJA, is about 95°C/W for the SOIC−8 (D) package, 45.8°C/W for the DDA

package, 66.6

°C/W for the SOIC−14 (D) package, and 37.5°C/W for the PWP package. Although the maximum

recommended junction temperature (TJ) is listed as 150°C, performance at this elevated temperature will suffer.

To ensure optimal performance, the junction temperature should be kept below 125

°C. Above this temperature,

distortion will tend to increase. Figure 44 shows the recommended power dissipation with a junction

temperature of 125

°C. If no solder is used to connect the PowerPAD to the PCB, the θJA will increase

dramatically with a vast reduction in power dissipation capability. For a given

θJA and a maximum junction

temperature, the power dissipation is calculated by the following formula:

D +

MAX

–T

Where:

= Power dissipation of THS6042/3 (watts)

TMAX = Maximum junction temperature allowed in the design (125°C recommended)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case (D−8 =38.3°C/W, DDA = 9.2°C/W,

D−14 = 26.9

°C/W, PWP = 1.4°C/W)

θCA = Thermal coefficient from case to ambient

−40

−20

100

Ta − Free-Air Temperature − °C

PWP

θJA = 37.5 °C/W

DDA

θJA = 45.8 °C/W

D-8

θJA = 95 °C/W

TJ = 125 °C

NOTE: Results are with no air flow and PCB size = 3”

× 3”

2 oz. trace and copper pad with solder unless otherwise noted.

D-14

θJA = 66.6 °C/W

Figure 44. Maximum Power Dissipation vs Free-Air Temperature

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