THS6042, THS6043

350 mA, ±12 V ADSL CPE LINE DRIVERS

SLOS264G − MARCH 2000 − REVISED DECEMBER 2001

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICE

EVALUATION

TA

SOIC-8

(D)

SOIC-8 PowerPAD

(DDA)

SOIC-14

(D)

TSSOP-14

(PWP)

EVALUATION

MODULES

0

°C to 70°C

THS6042CD

THS6042CDDA

THS6043CD

THS6043CPWP

THS6042EVM

THS6043EVM

−40

°C to 85°C

THS6042ID

THS6042IDDA

THS6043ID

THS6043IPWP

—

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current (see Note 1)

450 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential input voltage

± 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature

See Dissipation Ratings Table

. . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS6042 and THS6043 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected

to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature

which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD

thermally enhanced package.

DISSIPATION RATING TABLE

PACKAGE

θJA

θJC

TA = 25°C

TJ = 150°C

POWER RATING

D-8

95

°C/W‡

38.3

°C/W‡

1.32 W

DDA

45.8

°C/W‡

9.2

°C/W‡

2.73 W

D-14

66.6

°C/W‡

26.9

°C/W‡

1.88 W

PWP

37.5

°C/W

1.4

°C/W

3.3 W

‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test

PCB, the

ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.