A1

A2

B1

B2

B3

Top View

A3

C2

C1

C3

D2

D3

A4

B4

C4

D4

D1

LM3560

SNOSB43B – SEPTEMBER 2011 – REVISED AUGUST 2013

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DESCRIPTION (CONTINUED)

LED voltage, independent LED current control, a hardware flash enable allowing a logic input to trigger the flash

pulse, dual TX inputs which force the flash pulse into a low-current torch mode allowing for synchronization to RF

power amplifier events or other high-current conditions, and an integrated comparator designed to monitor an

NTC thermistor and provide an interrupt to the LED current. Additionally, an active high HWEN input provides a

hardware shutdown during system software failures.

The 2MHz switching frequency, over-voltage protection and adjustable current limit allow for the use of tiny, low-

profile (1 µH and 2.2 µH) inductors and (10 µF) ceramic capacitors. The device is available in a ultra-small 16-

bump (1.97mm x 1.97mm x 0.6mm) DSBGA package and operates over the

−40°C to +85°C temperature range.

Connection Diagram

16-Bump 1.97 mm x 1.97 mm x 0.6 mm DSBGA Package YZR0016

PIN DESCRIPTIONS

Pin

Name

Function

A1

LED1

High Side Current Source Output for Flash LED.

A2, B2

OUT

Step-Up DC/DC Converter Output. Connect a 10 µF ceramic capacitor between this pin and GND.

A3, B3

SW

Drain Connection for Internal NMOS and Synchronous PMOS Switches.

A4, B4

GND

Ground

B1

LED2

High-Side Current Source Output for Flash LED.

LEDI/NTC

Configurable as a High-Side Current Source Output for Indicator LED or Comparator Input for LED

C1

Temperature Sensing.

TX1/TORCH/

Configurable as a Dual-Polarity RF Power Amplifier Synchronization Input, an Interrupt Output, or as

C2

GPIO1

a General Purpose Logic I/O. This pin has an internal 300k

Ω pull down to GND.

C3

STROBE

Active High Hardware Flash Enable. Drive STROBE high to turn on the Flash pulse. This pin has an

internal 300 k

Ω pull down to GND.

C4

IN

Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a minimum 10

µF ceramic capacitor.

D1

TX2/INT/GPIO2

Configurable as a Dual-Polarity Power Amplifier Synchronization Input, an Interrupt Output, or as a

General Purpose Logic I/O. This pin has an internal 300 k

Ω pull down to GND.

D2

SDA

Serial Data Input/Output. High impedance in shutdown or in power down.

D3

SCL

Serial Clock Input. High impedance in shutdown or in power down.

Logic High Hardware Enable. HWEN is a high impedance input and is normally connected with an

D4

HWEN

external pull up resistor to a logic high voltage.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

2

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