Package information

M34E04B

30/35

DocID028428 Rev 1

8

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

8.1

UFDFN8 package information

Figure 14. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package outline

1. Max. package warpage is 0.05 mm.

2. Exposed copper is not systematic and can appear partially or totally according to the cross section.

3. Drawing is not to scale.

4. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating

(not connected) in the end application