HD3SS214 datasheet(6/25 Pages) TI1

6 / 25 page

HD3SS214

SLAS907 – DECEMBER 2015

www.ti.com

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IIH

Input High Current (Dx_SEL, AUX_SEL)

VDD = 3.6 V, VIN = VDD

µA

IIM

Input Mid Current (AUX_SEL)

VDD = 3.6 V, VIN = VDD/2

µA

IIL

Input Low Current (Dx_SEL, AUX_SEL)

VDD = 3.6 V, VIN =GND

µA

Leakage Current (Dx_SEL, AUX_SEL)

VDD = 3.3 V, VIN = 2 V, OE = 3.3 V

µA

VDD = 3.3 V, VIN = 2 V, OE = 3.3 V;

Leakage Current (HPDx)

µA

ILKG

Dx_SEL = 3.3 V

VDD = 3.3 V, VIN = 2 V, OE = 3.3 V;

Leakage Current (HPDx)

µA

Dx_SEL = GND

IOFF

Device Shut Down Current

VDD = 3.6 V, OE = GND

2.5

µA

IDD

Supply Current

VDD = 3.6 V, Dx_SEL/AUX_SEL = VDD/GND

0.6

DA, DB, DC HIGH SPEED SIGNAL PATH

CON

Outputs ON Capacitance

VIN = 0 V, Outputs Open, Switch ON

0.6

COFF

Outputs OFF Capacitance

VIN = 0 V, Outputs Open, Switch OFF

0.8

RON

ON resistance

VDD = 3.3 V, VCM = 0.5 V – 1.5 V, IO = -40 mA

On resistance match between pairs of the

VDD = 3.3 V, VCM = 0.5 V ≤ VIN ≤ 1.2 V,

ΔRON

1.5

same channel

IO = -40 mA

On resistance flatness

R(FLAT_ON)

VDD = 3.3 V, VCM = 0.5 V ≤ VIN ≤ 1.2 V

1.3

(RON(MAX) – RON(MAIN)

AUXX, DDC, SIGNAL PATH

RON(AUX)

ON resistance on AUX channel

VDD = 3.3 V, VCM = 0 V – VDD, IO = -8 mA

RON(DDC)

ON resistance on DDC channel

VDD = 3.3 V, VCM = 0.4 V, IO = -3 mA

6.6 Electrical Characteristics, Device Parameters

over operating free-air temperature range (unless otherwise noted)

PARAMETER(1)

TEST CONDITIONS

MIN

TYP

MAX

UNIT

1.35 GHz

–0.9

Dx Differential Insertion Loss

2.7 GHz

–1.4

4.05 GHz

–1.6

1.35 GHz

–17

Dx Differential Return Loss

2.7 GHz

–13

4.05 GHz

–11

1.35 GHz

XTALK

Dx Differential Crosstalk

2.7 GHz

–53

4.05 GHz

–47

1.35 GHz

OIRR

Dx Differential Off-Isolation

2.7 GHz

–26

4.05 GHz

–24

AUX Bandwidth

500

MHz

(1)

For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum

length traces on the input and output of the device under test.

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