Analog Integrated Circuit Device Data



Freescale Semiconductor

6

BC3770

4

Electrical Characteristics

4.1

Maximum Ratings

Stress(es) beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the following operational sections

of the specifications is not implied. Exposure to absolute maximum rating condition(s) for extended periods may affect device reliability.

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Symbol

Rating

Min.

Max.

Unit

Notes

ELECTRICAL RATINGS

VBUS, PMID to GND

-0.3

20

V

(1)

LX to GN

-0.3

20

V

(1)

BOOT to LX

-0.3

5.5

V

(1)

BOOT to GND

-0.3

25.5

V

PGND, BATSNSN to GND

-0.3

0.3

V

(1)

VL to GND

-0.3

5.5

V

VSYS, CHGOUT, BATREG to GND

-0.3

Continuous

6.0

V

PGND to GND

-0.3

0.3

V

(1)

All Other Pins to GND

-0.3

5.5

(1)

ESD Voltage

• Human Body Model (HBM)

• Machine Model

—

—

2000

200

V

(2)

(3)

THERMAL RATINGS

Continuous Power Dissipation

—

—

—

2.08

1.14

0.832

W

Operating Temperature

• Ambient

-40

85

Maximum Temperature

• Junction

—

150

Storage Ambient Temperature

-65

150

Lead Soldering Temperature (within 10 s)

—

300

°C

Thermal Resistance Junction to Ambient

—

48

°C/W

(4), (5)

Notes

1.

GND: all of the PGND and GND should be within the limit.

2.

Human Body Model (HBM) per JESD22-A114 for all pins

3.

Highly depends on the PCB heat dissipation. Tested with the Thermal Characteristics test condition below.

4.

5.

Measured in still air, free convection condition (conforms to EIA/JESD51-2) on high effective thermal conductivity JESD51-7 test board.