LP3997 datasheet(3/18 Pages) TI

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LP3997

www.ti.com

SNVS272B – MAY 2004 – REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

Input Voltage

-0.3 to 6.5V

Output Voltage

-0.3 to (VIN + 0.3V) with 6.5V (max)

SD Input Voltage

-0.3 to (VIN + 0.3V) with 6.5V (max)

Junction Temperature

150°C

Lead/Pad Temp.

VSSOP

260°C

Storage Temperature

-65 to 150°C

Continuous Power Dissipation

Internally Limited(4)

Human Body Model(5)

2KV

All Pins Except CBYP

Machine Model

200V

ESD

Human Body Model(5)

1KV

CBYP Pin

Machine Model

100V

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All Voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

(5)

The human body model is 100pF discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor

discharged directly into each pin.

Operating Ratings

(1)

Input Voltage

2V to 6V

Junction Temperature

-40°C to 125°C

Ambient Temperature TA Range

(2)

-40°C to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the

maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).

Thermal Properties

(1)

Junction To Ambient Thermal Resistance(2),

θJA (VSSOP)

210°C/W

(1)

Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the

device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power

dissipation is possible, special care must be paid to thermal dissipation issues in board design.

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