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CMX608 датащи(PDF) 69 Page - CML Microcircuits |
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CMX608 датащи(HTML) 69 Page - CML Microcircuits |
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69 / 70 page ![]() RALCWI Vocoder CMX608/CMX618/CMX638 2014 CML Microsystems Plc 69 D/608_18_38/11 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required A B C H TYP. MAX. MIN. DIM. J 1.00 0.80 0.05 0.30 0.00 0.18 7.00 BSC 7.00 BSC * * NOTE : * All dimensions in mm Angles are in degrees A & B are reference data and do not include mold deflash or protrusions. F 5.65 4.60 G 5.65 4.60 L 0.50 0.30 Index Area 1 Dot Index Area 2 Dot Chamfer Index Area 1 is located directly above Index Area 2 P T 0.50 0.20 L1 0.15 0 Exposed Metal Pad K 0.20 0.90 0.25 0.40 Figure 23 48-pin VQFN Mechanical Outline (Q3) Order as part no. CMX608/CMX618/CMX638Q3 As package dimensions may change after publication of this datasheet, it is recommended that you check for the latest Packaging Information from the Datasheets page of the CML website: [http://www.cmlmicro.com/]. |
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