15

LTC692/LTC693

S

APPLICATI

TYPICAL

Write Protect for Additional RAMs

N8 Package

8-Lead Plastic DIP

Dimensions in inches (millimeters) unless otherwise noted.

PACKAGE DESCRIPTIO

N8 0393

0.045 ± 0.015

(1.143 ± 0.381)

0.100 ± 0.010

(2.540 ± 0.254)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.130 ± 0.005

(3.302 ± 0.127)

0.020

(0.508)

MIN

0.018 ± 0.003

(0.457 ± 0.076)

0.125

(3.175)

MIN

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.320

(7.620 – 8.128)

0.325

+0.025

–0.015

+0.635

–0.381

8.255

()

12

3

4

87

6

5

0.250 ± 0.010

(6.350 ± 0.254)

0.400

(10.160)

MAX

1

2

3

4

0.150 – 0.157

(3.810 – 3.988)

8

7

6

5

0.189 – 0.197

(4.801 – 5.004)

0.228 – 0.244

(5.791 – 6.197)

0.016 – 0.050

0.406 – 1.270

0.010 – 0.020

(0.254 – 0.508)

× 45°

0°– 8° TYP

0.008 – 0.010

(0.203 – 0.254)

SO8 0393

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

S8 Package

8-Lead Plastic SOIC

10

µF

LTC693

GND

LTC692/3 • TA04

LOW LINE

CE IN

CE OUT

0.1

µF

CS

20ns PROPAGATION

DELAY

62512

5V

3V

0.1

µF

+

62128

62128

OPTIONAL CONNECTION FOR

ADDITIONAL RAMs

0.1

µF

0.1

µF

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of circuits as described herein will not infringe on existing patent rights.