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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AN4630 датащи(PDF) 28 Page - STMicroelectronics |
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AN4630 датащи(HTML) 28 Page - STMicroelectronics |
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28 / 33 page  Design recommendations when using WLCSP34 package AN4630 Figure 24: RF ground on the discrete balun application board To design the board with the integrated balun as matching network all the above suggestions has to be implemented. The only difference is located in the balun zone where the datasheet recommendation has to be followed. Particular attention to the ground must be observed: also in this case the RF ground in the TOP layer is “hot” and it could generate pulling. The RF TOP layer ground has to be extended to the balun zone (see Figure 25: "RF ground on the integrated balun application board "), but has to be merged to the other ground on the INNER3 layer. Figure 25: RF ground on the integrated balun application board 28/33 DocID027262 Rev 1 |
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