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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AN4630 датащи(PDF) 14 Page - STMicroelectronics |
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AN4630 датащи(HTML) 14 Page - STMicroelectronics |
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14 / 33 page  Two or multi-layer application boards AN4630 3 Two or multi-layer application boards Two or multi-layers application boards Different approach has to be taken when an application board is designed using the QFN32 or the WLCSP34 package. 3.1 QFN32 package In this case the best solution is to use a two-layer application board. Figure 9: QFN32 package application board stack-up layer The two layers have to be so distributed: 1. TOP layer: used for routing. 2. BOTTOM layer: used for grounding under the RF zones and for routing on the rest. 3.2 WLCSP34 package In this case, it is not possible to design a two layers board and the stack-up layer is a multilayer one due to the complexity of the package. In Figure 10: "WLCSP34 package application board stack-up layer " the suggested stack-up layer. Figure 10: WLCSP34 package application board stack-up layer 14/33 DocID027262 Rev 1 |
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