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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AN4630 датащи(PDF) 23 Page - STMicroelectronics |
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AN4630 датащи(HTML) 23 Page - STMicroelectronics |
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23 / 33 page  AN4630 Design recommendations when using WLCSP34 package Figure 18: WLCSP34 ground connection (TOP layer view) In the INNER2 layer, Figure 19: "WLCSP34 ground connection (INNER2 layer view)", buried filled vias have to be used to connect INNER2 layer ground and INNER 3 layer ground. The buried filled vias have to be put with 400 um of offset (both in x and y directions) respect to laser vias. In the INNER2 layer the GND_SMPS has to be kept separated from the GND. It is necessary not put ground layer under the RF discrete balun. This is because due to the very little distance between TOP and INNER2 layers; 80 um, the parasitic capacitances would be too big and would not be possible to find a working solution of the matching network. DocID027262 Rev 1 23/33 |
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