DocID024655 Rev 3

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TN1037

Cooling techniques and heatsink mounting proposals

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Figure 8 shows an example of metal traces layout used to dissipate heat on the PCB.

Figure 8. Copper plate on the PCB

Higher thermal performance can be achieved by using a compact external heatsink, in close

contact with the SLLIMM-nano.

2.2

Heatsink pasted on the package

The heatsink can be directly pasted on the package of the SLLIMM-nano using a uniform

layer of thermal conductive glue or an adhesive foil between the heatsink and the topside of

the package, as shown in

Figure 9 and Figure 10.

Figure 9. Small heatsink pasted on the package