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AN2836 датащи(PDF) 35 Page - STMicroelectronics

номер детали AN2836
подробное описание детали  Modern motion control applications need more flexibility that can be addressed
PDF  57 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN2836 датащи(HTML) 35 Page - STMicroelectronics

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AN2836
Designing an application with L6225, L6226, L6227
Doc ID 15084 Rev 1
35/57
Figure 39.
Maximum output current vs. selectable devices
4.16.2
Power dissipation and thermal analysis with PractiSPINTM software
The PractiSPINTM software includes a power dissipation and thermal analysis section that
helps in calculating the IC power dissipation and estimating its junction temperature, through
a simulation.
This section is intended to help to give a fast evaluation of the device, package and
dissipating copper area required by the user’s application, and to be a good starting point for
designing an application (from the power dissipation and thermal point of view). Software
results, especially thermal results, need to be confirmed on the bench.
The input data for simulation are divided in three sections:
a)
Application data: to select the motor characteristics and its configuration, the
driving parameters and the analysis type (steady state, single pulse or repeated
pulse analysis).
b)
Device data: to choose the device part number and to edit some available IC
parameters.
c)
PCB data: to select the package, the PCB dissipating charcteristics and ambient
temperature.
The output data include the waveforms of temperature and current profile, the estimated IC
power dissipation and junction temperature.
For more details on the formulas used in the software, please refer to the "Help" menu of
“Power Dissipation and Thermal Analysis”.



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