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AN2836 датащи(PDF) 14 Page - STMicroelectronics

номер детали AN2836
подробное описание детали  Modern motion control applications need more flexibility that can be addressed
PDF  57 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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AN2836 датащи(HTML) 14 Page - STMicroelectronics

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Designing an application with L6225, L6226, L6227
AN2836
14/57
Doc ID 15084 Rev 1
High-current GND tracks (i.e. the tracks connected to the sensing resistors) must be
connected directly to the negative terminal of the bulk capacitor. A good quality, high-
frequency bypass capacitor is also required (typically a 100 nF÷200 nF ceramic would
suffice), since electrolytic capacitors show a poor high frequency performance. Both bulk
electrolytic and high-frequency bypass capacitors have to be connected with short tracks to
VSA, VSB and GND. On the L6225, L6226, L6227 GND pins are the logic GND, since only
the quiescent current flows through them. Logic GND and power GND should be connected
together in a single point, the bulk capacitor, to keep noise in the power GND from affecting
logic GND. Specific care should be paid layouting the path from the SENSE pins through the
sensing resistors to the negative terminal of the bulk capacitor (power ground). These tracks
must be as short as possible in order to minimize parasitic inductances that can cause
dangerous voltage spikes on the SENSE and OUT pins (see Section 4.2: Voltage ratings
and operating range). For the same reason the capacitors on VSA, VSB and GND should be
very close to the GND and supply pins. Refer to Section 4.5: Sensing resistors for
information on selecting the sense resistors. Traces connected to VSA, VSB, SENSEA,
SENSEB, and the four OUT pins must be designed with adequate width, since high currents
are flowing through these traces, and layer changes should be avoided. Should a layer
change prove necessary, multiple and large via holes have to be used. A wide GND copper
area can be used to improve heat removal, thus reducing thermal resistance.
Figure 8 shows two typical situations that must be avoided. An important consideration
about the location of the bulk capacitors is the ability to absorb the inductive energy from the
load, without allowing the supply voltage to exceed the maximum rating. The diode shown in
Figure 8 prevents the recirculation current from reaching the capacitors and results in a high
voltage on the IC pins that can damage the device. Having a switch or a power connection
that can disconnect the capacitors from the IC, while there is still current in the motor, also
results in a high-voltage transient since there is no capacitance to sink the recirculation
current.
Figure 8.
Two situations that must be avoided



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