DocID024294 Rev 4

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TN0985

Procedure

32

Burn-in test

883 TM1015 240

hours at 125 °C per

minute

883 TM1015 240 hours at

Interim

electrical

measurements

Per applicable SMD,

with deltas

Per applicable ESCC detailed

specification with deltas

Per applicable ESCC detailed

specification with deltas(5)

Reverse bias

burn-in

883 TM1015 72

hours at 150 °C

883 TM1015 cond. A 72 hours

125 °C

883 TM1015 cond. A 72 hours

NMOS+72 hours PMOS at 125 °C(7)

Final electrical

tests at room

temperature

Per applicable SMD,

with deltas

Per applicable ESCC detailed

specification with deltas

Per applicable ESCC detailed

specification with deltas(5)

calculation

5 % with 3 % max.

functional failure

5 % applied at the end of screening flow

Final electrical

test of three

temperatures

Static, dynamic, and AC's

Seal (fine and

gross)

883 TM1014

Radiographic

883 TM2012

Not performed

883 TM2012

External visual

883 TM2009

TM2009

ESA # 20500, 205900, and 883

TM2009 paragraph 3.3.6(b) and

3.3.7(A)

Solderability

883 TM2003 (five parts, all leads)

1. SPC = tool which ensures that the precision machined components manufactured for the aerospace and defense industries

meet customer requirements.

2. SEM = scanning electron microscope

3. PIND = particle impact noise detection

4. SMD = standard microcircuit drawing

6. Burn-in is done after reverse bias burn-in.

8. NMOS = NMOS logic

9. PMOS = PMOS logic

10. PDA = percent defective allowable

11. At 25 °C: static, functional and switching tests. At +125 °C and -55 °C: static and functional tests.

12. ESA = European space agency

Table 1. Comparison between Class S, ESCC 9000 flow chart F3, and ST “Class S equivalent” flow

(continued)

Screen

Screening test comparison

ST “Class S equivalent” flow

Class S

ESCC 9000 flow chart F3