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TN0985 датащи(PDF) 9 Page - STMicroelectronics |
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TN0985 датащи(HTML) 9 Page - STMicroelectronics |
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9 / 32 page ![]() DocID024294 Rev 4 9/32 TN0985 Procedure 32 Sub. 3a: thermal shock 883 TM1011 15/0 883 TM1011 C 15/0 Chart F4 subgroup 1 883 TM1011 C 5/0 Sub. 3b: temperature cycle 883 TM1010 Not performed Done in group B Sub. 3c: moisture resistance 883 TM1004 883 TM1004 15/0 883 TM1004 5/0 Sub. 3d: visual examination 883 TM1004 and 1010 ESCC 20400 + 2049000 Chart F4 subgroup 1 ESCC 20400 + 2049000 Sub. 3e: seal (fine and gross) 883 TM1014 883 TM1014 883 TM1014 Sub. 3f: endpoint electrical ESCC detailed specification ESCC detailed specification Sub. 4a: mechanical shock 883 TM2002 883 TM2002 B 883 TM2002B Sub. 4b: vibration 883 TM2007 883 TM2007 A 883 TM2007 A Sub. 4c: constant acceleration 883 TM2001 cond. E 883 TM2001E 883 TM2001 E Table 4. Comparison between Group D tests for Class S, ESCC 9000, and ST “Class S equivalent” flow (continued) QCI comparison ST “Class S equivalent” flow Group D tests for Class S ESCC 9000 Test Test method Pass criteria Test method Pass criteria Test performed during Test method Pass criteria |
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