9

HIP0082, HIP0084

Power Small Outline Plastic Package (PSOP)

E2

1

2

3

E

2 PLACES

D1

E1

-B-

E3

N

D

b

SEATING

A

-C-

-A-

A1

SEE DETAIL "A"

A2

C

0.10

SECTION "B-B"

b

c

3.10 REF.

SEATING

PLANE

DETAIL "A"

B

B

1.60 REF.

GAUGE

L

0.15

REF.

A3

HEAT

PLANE

SLUG

L1

PLANE

-H-

e

M20.433

20 LEAD POWER SMALL OUTLINE PLASTIC

PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.122

0.142

3.10

3.60

-

A1

0.004

0.012

0.10

0.30

-

A2

0.118

0.130

3.00

3.30

-

A3

0.000

0.004

0.00

0.10

-

b

0.016

0.021

0.40

0.53

6, 7

b1

0.016

0.020

0.40

0.50

6, 7

c

0.009

0.013

0.23

0.32

7

c1

0.009

0.011

0.23

0.29

7

D

0.622

0.630

15.80

16.00

3

D1

0.496

0.512

12.60

13.00

-

D2

-

0.043

-

1.10

-

E

0.547

0.571

13.90

14.50

-

E1

0.429

0.437

10.90

11.10

4

E2

-

0.114

-

2.90

-

E3

0.228

0.244

5.80

6.20

-

e

0.050 BSC

1.27 BSC

-

L

0.031

0.043

0.80

1.10

5

L1

0.014 BSC

0.35 BSC

-

N20

20

-

Rev. 0 3/96

NOTES:

1. Dimensioning and tolerancing per ANSI Y14.5M-1982.

2. "C" is a reference datum. Seating plane is defined by

lead tips only.

3. Dimension D does not include mold flash, protrusions

or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15 per side. D measured at -H-.

4. Dimension E1 does not include interlead flash or pro-

trusion. Interlead flash or protrusion shall not exceed

0.15 per side. E1 measured at -H-.

5. Dimension "L" is the length of terminal for soldering to

a substrate.

6. The lead width dimension does not include dambar

protrusion. Allowable dambar protrusion shall be

0.08mm total in excess of the lead width dimension at

maximum material condition.

7. Section "B-B" to be determined at 0.10mm to 0.25mm

from the lead tip.

8. Controlling dimension: MILLIMETER.

9. Dimensions conform with JEDEC Outline MO-166AA

Issue B.

17.15

LAND PATTERN

N

1

13.92

4.22

1.52

0.71

2.87

e

7.26

4.09

2.21

4.09