Heatsink provision

TDA7493

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Doc ID 14570 Rev 6

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Heatsink provision

With the exposed-pad packages, it is possible to use the printed circuit board as a heatsink.

exposed pad, a thermal resistance of 37 °C/W can be achieved.

The amount of power dissipated within the device depends primarily on the supply voltage,

load impedance and output modulation level. The maximum estimated power dissipation for

the TDA7493 is around 1.1 W.

than 40 °C above ambient can be expected, thus giving a maximum junction temperature,

Tj, of approximately 90 °C in consumer environments where 50 °C is specified as the

maximum ambient temperature. This provides a comfortable safety margin to the thermal

protection threshold at Tj = 150 °C.