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TDA7493 датащи(PDF) 27 Page - STMicroelectronics |
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TDA7493 датащи(HTML) 27 Page - STMicroelectronics |
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27 / 30 page ![]() TDA7493 Package mechanical data Doc ID 14570 Rev 6 27/30 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 10. HTSSOP24 EPD dimensions Reference mm inch Notes Min Typ Max Min Typ Max A - -1.20 --0.047 - A1 - - 0.15 - - 0.006 - A2 0.80 1.00 1.05 0.031 0.039 0.041 - b 0.19 - 0.30 0.007 - 0.012 - c 0.09 - 0.20 0.004 - 0.008 - D 7.70 7.80 7.90 0.303 0.307 0.311 (1) 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm (0.006 inch) per side. D1 4.80 5.00 5.2 0.189 0.197 0.205 - E 6.20 6.40 6.60 0.244 0.252 0.260 - E1 4.30 4.40 4.50 0.169 0.173 0.177 (2) 2. Dimension E1 does not include interlead flash or protrusions. Interlead flash or protrusions does not exceed 0.25mm (0.010 inch) per side. E2 3.00 3.20 3.40 0.118 0.126 0.134 - e - 0.65 - - 0.026 - - L 0.45 0.60 0.75 0.018 0.024 0.030 - L1 - 1.00 - - 0.039 - - aaa - - 0.10 - - 0.004 - k0 - 8 0 - 8 degrees |
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