Datasheet

BMM150 Geomagnetic Sensor

Page 48

BST-BMM150-DS001-01 | Revision 1.0 | April 2013

Bosch Sensortec

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to

third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice.

9.2 Landing pattern recommendation

For the design of the landing pattern, we recommend the following dimensioning:

To be discussed

E1

D2

D4

E5

C5

A5

B4

C1

A1

B2

0.4

0.4

0.2

0.283

0.283

0.762

0.798

1.56

0.035

A3

E3

Figure 24: Landing patterns relative to the device pins, dimensions are in mm

Note: Recommended thickness of solder paste is 100µm.

The land pattern depicted in Figure 24 may be used similarly for PCBs designed with NSMD as

well as SMD process.

For the NSMD process, landing dimensions as in Figure 24 should be defined in the metal layer

while the solder mask openings should be larger than the defined metal pads.

In case of SMD process, land dimensions should be defined by solder mask which openings are

smaller than underlying metal pads.

Land Pattern is presented as guideline; designer should always use their own experience.

Choice between SMD and NSMD is determined by customer.