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AT45DB321D датащи(PDF) 43 Page - List of Unclassifed Manufacturers |
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AT45DB321D датащи(HTML) 43 Page - List of Unclassifed Manufacturers |
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43 / 52 page ![]() 43 AT45DB321D [DATASHEET] 3597T–DFLASH–11/2013 24. Ordering Information Ordering Code Detail Green Package Options (Pb/Halide-free/RoHS Compliant) Notes: 1. The shipping carrier option is not marked on the devices. 2. Standard parts are shipped with the page size set to 528 bytes. The user is able to configure these parts to a 512-byte page size, if desired. 3. Parts ordered with suffix SL954 are shipped in bulk, with the page size set to 512 bytes. Parts will have “954” or “SL954” marked on them. 4. Parts ordered with suffix SL955 are shipped in tape and reel, with the page size set to 512 bytes. Parts will have “955” or “SL955” marked on them. Ordering Code(1)(2) Package Lead Finish Operating Voltage fSCK (MHz) Operation Range AT45DB321D-MU AT45DB321D-MU-SL954(3) AT45DB321D-MU-SL955(4) 8M1-A Matte Sn 2.7V to 3.6V 66 Industrial (-40 C to 85C) 2.7V to 3.6V AT45DB321D-MWU AT45DB321D-MWU-SL954(3) AT45DB321D-MWU-SL955(4) 8MW AT45DB321D-SU AT45DB321D-SU-SL954(3) AT45DB321D-SU-SL955(4) 8S2 AT45DB321D-TU 28T AT45DB321D-CU 24C3 Matte Sn 2.7V to 3.6V 66 AT45DB321D-MU-2.5 8M1-A Matte Sn 2.5V to 3.6V 50 AT45DB321D-SU-2.5 8S2 Package Type 8M1-A 8-pad, 6 x 5 x 1.0mm, very thin micro lead-frame package MLF™ (VDFN) 8MW 8-pad, 8 x 6 x 1.0mm, very thin micro lead-frame package MLF (VDFN) 8S2 8-lead, 0.209in-wide, plastic gull wing small outline package (EIAJ SOIC) 28T 28-lead, 8mm x 13.4mm, plastic thin small outline package, type I (TSOP) 24C3 24-ball, 6mm x 8mm x 1.4mm ball grid array with a 1mm pitch 5 x 5 ball matrix AT 4 5 D 3 2 MW U 1D– B Designator Product Family Device Density 32 = 32-megabit Interface 1 = Serial Package Option M = 8-pad, 6 x 5 x 1mm MLF (VDFN) MW = 8-pad, 8 x 6 x 1mm MLF (VDFN) S = 8-lead, 0.209" wide SOIC T = 28-lead, TSOP Device Grade U = Matte Sn lead finish, industrial temperature range (-40°C to +85°C) Device Revision C = 24 Ball BGA |
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