TCS3772

COLOR LIGHT-TO-DIGITAL CONVERTER

with PROXIMITY SENSING

TAOS145B − SEPTEMBER 2012

28

r

r

Copyright

E 2012, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

PACKAGE INFORMATION

PACKAGE FN

Dual Flat No-Lead

650

BSC

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

2000

+ 75

2400

+ 75

PIN 1

PIN 1

END VIEW

650

+ 50

PIN OUT

TOP VIEW

750

+ 100

295

Nominal

406

+ 10

Photodiode Array Area (Note B)

of Photodiode Array Area (Note B)

CL

125 Nominal

6 SDA

5 INT

4 LDR

SCL 2

GND 3

496

+ 10

Photodiode Active Area

(Note C)

NOTES: A. All linear dimensions are in micrometers.

B. The die is centered within the package within a tolerance of

± 75 μm.

C. Double-Half Etch (DHE) is 97

± 20 μm. Non-DHE is 203 ± 8 μm.

D. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

E. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

F. This package contains no lead (Pb).

G. This drawing is subject to change without notice.

Figure 19. Package FN — Dual Flat No-Lead Packaging Configuration