PAC7366

NTSC/PAL Digital Image SOC

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22

PixArt Imaging Inc.

V1.10

Dec. 2012

Recommended Guideline for PCB Assembly

I.

ecommended vender and type for Pb-free solder paste

1

Almit LFM-48W TM-HP

2

Senju M705-GRN360-K

II.

IR Reflow Soldering Profile

Temperature profile is the most important control in reflow soldering. It must be fine tuned to establish a

robust process. The typical recommended IR reflow profile is showed in figure 8 below.

Fig.13.3 IR Reflow Profile

Reflow Profile

1. Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/ Sec

2. Preheat zone:

2.1

Temp ramp from 170~ 200 degree C

2.2

Exposure time: 90 +/- 30 sec

3. Melting zone:

3.1

Melting area temp > 220 degree C for at least 30 ~ 50 sec

3.2

Peak temperature : 245 degree C.