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CD00237391 датащи(PDF) 14 Page - STMicroelectronics |
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CD00237391 датащи(HTML) 14 Page - STMicroelectronics |
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14 / 177 page ![]() Comm. interfaces SPI/(I2S) 3 (2)(2) I2C 3 USART UART 4 2 USB OTG FS Yes USB OTG HS Yes CAN 2 Camera interface Yes GPIOs 82 114 140 SDIO Yes 12-bit ADC Number of channels 3 16 24 24 12-bit DAC Number of channels Yes 2 Maximum CPU frequency 120 MHz Operating voltage 1.8 V to 3.6 V(3) Operating temperatures Ambient temperatures: –40 to +85 °C/–40 to +105 °C Junction temperature: –40 to + 125 °C Package LQFP100 LQFP144 LQFP176/ UFBGA176 1. For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. 2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. VDD minimum value is 1.7 V when the device operates in the 0 to 70 °C temperature range and IRROFF is set to VDD. Table 3. STM32F207xx features and peripheral counts (continued) Peripherals STM32F207Vx STM32F207Zx STM32F207Ix |
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