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MPC8548ECHXATHA датащи(PDF) 94 Page - Freescale Semiconductor, Inc |
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MPC8548ECHXATHA датащи(HTML) 94 Page - Freescale Semiconductor, Inc |
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94 / 151 page ![]() MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9 94 Freescale Semiconductor Package Description Figure 56. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA with Stamped Lid Notes: 1. All d imensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Capacitors may not be present on all devices. 6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top. 7. Parallelism measurement shall exclude any effect of mark on top surface of package. 8. All dimensions are symmetric across the package center lines unless dimensioned otherwise. |
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