DF1704ESLASH2K datasheet(2/20 Pages) TI1

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DF1704

SBAS099A

NAME

I/O

DESCRIPTION

DIN

Serial Audio Data Input(3)

BCKIN

Bit Clock Input for Serial Audio Data(3)

3I2S

Input Audio Data Format Selection(2, 4)

IW0

Input Audio Data Word Selection(2, 4)

IW1

Input Audio Data Word Selection(2, 4)

XTI

Oscillator Input /External Clock Input

XTO

OUT

Oscillator Output

8VSS

—

Digital Ground

CLKO

OUT

Buffered System Clock Output

MODE

Mode Control Selection (H: Software, L: Hardware)(1)

MD/CKO

Control Data Input/Clock Output Frequency

Select(1, 5)

MC/LRIP

Control Data Clock/Polarity of LRCK Select(1, 5)

ML/RESV

Control Data Latch/Reserved (1, 5)

RST

Reset. When this pin is LOW, the digital filter

is held in reset.(1)

MUTE

Mute Control(1, 4)

DEM

De-Emphasis Control(2, 4)

SF0

Sampling Rate Select for De-emphasis(2, 4)

SF1

Sampling Rate Select for De-emphasis(2, 4)

OW0

Output Audio Data Word and Format Select(2, 4)

OW1

Output Audio Data Word and Format Select(2, 4)

—

No Connection

VDD

—

Digital Power, +5V

DOR

OUT

Rch, Serial Audio Data Output

DOL

OUT

Lch, Serial Audio Data Output

WCKO

OUT

Word Clock for Serial Audio Data Output

BCKO

OUT

Bit Clock for Serial Audio Data Output

SRO

Filter Response Select (2, 4)

LRCIN

L/R Clock Input (fS) for Serial Audio Data(3)

NOTES: (1) Pins 10-15; Schmitt-Trigger input with pull-up resistor. (2) Pins

3-5, 16-20, 27; Schmitt-Trigger input with pull-down resister. (3) Pins 1, 2,

28; Schmitt-Trigger input. (4) Pins 3-5, 15-20, 27; these pins are invalid

when MODE (pin 10) is HIGH. (5) Pins 11-13; these pins have different

functions corresponding to MODE (pin 10), (HIGH/LOW).

PIN ASSIGNMENTS

PIN CONFIGURATION

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

Supply Voltage (VDD , VCC1, VCC2R, VCC2L) .................................... +6.5V

Supply Voltage Differences .................................................................

±0.1

GND Voltage Differences ..................................................................

±0.1V

Digital Input Voltage ................................................. –0.3V to (VDD + 0.3V)

Input Current (any pins except power supplies) .............................

±10mA

Power Dissipation .......................................................................... 300mW

Operating Temperature Range ......................................... –25

°C to +85°C

Storage Temperature ...................................................... –55

°C to +125°C

Lead Temperature (soldering, 5s) ................................................. +260

°C

Package Temperature (reflow, 10s) .............................................. +235

°C

ABSOLUTE MAXIMUM RATINGS

DIN

BCKIN

I2S

IW0

IW1

XTI

XTO

CLKO

MODE

MD/CKO

MC/LRIP

ML/RESV

RST

LRCIN

SRO

BCKO

WCKO

DOL

DOR

OW1

OW0

SF1

SF0

DEM

MUTE

DF1704E

NC: No Connection

TOP VIEW

SSOP

PACKAGE

SPECIFIED

DRAWING

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE

NUMBER

RANGE

MARKING

NUMBER

MEDIA

DF1704E

SSOP-28

324

–25

°C to +85°C

DF1704E

Rails

PACKAGE/ORDERING INFORMATION

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